Hardware

Cervoz launches U.3 Enterprise SSD

Cervoz, a computer hardware manufacturer, has launched the U.3 Enterprise SSD - T443. The system includes 3D TLC NAND Flash (eTLC) technology, a 2.5-inch U.3 (backward-compatible with U.2) form factor, and capacities ranging from 1920GB to 7680GB.

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June 6, 2024

Cervoz, a computer hardware manufacturer, has launched the U.3 Enterprise SSD - T443, according to a press release.

The system includes 3D TLC NAND Flash (eTLC) technology, a 2.5-inch U.3 (backward-compatible with U.2) form factor, and capacities ranging from 1920GB to 7680GB.

Additional features include:

• 99% Quality of Service (QoS) with minimal latency for consistent high-seed data processing.
• Advanced heat dissipation design and Dynamic Thermal Throttling.
• Engineering for power efficiency.
• Data protection features such as AES-256bit Encryption, Advance LDPC ECC Engine, and End-to-End Data Protection.
• Sequential read/write speeds of up to 7,000/6,800 MB/s.
• 4KB random read/write performance of up to 1,600K/180K IOPS.
• Mean Time Between Failures (MTBF) of 2,500,000.
• Up to 1 Drive Write Per Day (DWPD).
• Operating temperature range of 0-degrees-to-70-degrees Celsius (32-degrees-to-158-degrees Fahrenheit.)